1. 2 Site BGA 1301 Device, 0.4 Pitch
2. Board Thickness：4.4mm
3. 8G PCIE, 5G USB, 1.5G MIPI
4. 3.2G LPDDR4
5. Max Power Current 8A
6. Support -40°C – 125°C Temperature Test
1. 2 Site BGA 1301 Device, 0.4 Pitch
2. Board Thickness：4.4mm
3. 8G PCIE, 5G USB, 1.5G MIPI
4. 3.2G LPDDR4
5. Max Power Current 8A
6. Support -40°C – 125°C Temperature Test
