FT LB

1. 2 Site BGA 1301 Device, 0.4 Pitch 2. Board Thickness:4.4mm 3. 8G PCIE, 5G USB, 1.5G MIPI 4. 3.2G LPDDR4 5. Max Power Current 8A 6. Support -40°C – 125°C Temperature Test

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Product DescriptionProduct ParametersApplication Field

1. 2 Site BGA 1301 Device, 0.4 Pitch

2. Board Thickness:4.4mm

3. 8G PCIE, 5G USB, 1.5G MIPI

4. 3.2G LPDDR4 

5. Max Power Current 8A

6. Support -40°C – 125°C  Temperature Test

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